usbc_soldering_iron/hw/usbc_soldering_iron.kicad_pcb

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	(version 20260206)
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	(generator_version "10.0")
	(general
		(thickness 1)
		(legacy_teardrops no)
	)
	(paper "A4")
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		(4 "In1.Cu" signal)
		(6 "In2.Cu" signal)
		(2 "B.Cu" signal)
		(9 "F.Adhes" user "F.Adhesive")
		(11 "B.Adhes" user "B.Adhesive")
		(13 "F.Paste" user)
		(15 "B.Paste" user)
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		(7 "B.SilkS" user "B.Silkscreen")
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		(19 "Cmts.User" user "User.Comments")
		(21 "Eco1.User" user "User.Eco1")
		(23 "Eco2.User" user "User.Eco2")
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		(39 "User.1" user)
		(41 "User.2" user)
		(43 "User.3" user)
		(45 "User.4" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
				(color "Black")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(color "White")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 2"
				(type "core")
				(thickness 0.64)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 3"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(copper_finish "None")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(tenting
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