(footprint "ATB322524-0110-T000" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (attr smd)
  (fp_text reference "REF**" (at 0 -1.85 unlocked) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.1)))
    (tstamp 0d3e7e5a-77d9-4810-af88-6a5e55af27b1)
  )
  (fp_text value "ATB322524-0110-T000" (at 0.05 3.6 unlocked) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 5c1b8ba2-ca8b-4540-b07a-d8663a22061f)
  )
  (fp_text user "${REFERENCE}" (at 0 1.95 unlocked) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp b8bb4a96-3cc8-4003-a5cc-59ab32a32c86)
  )
  (fp_line (start -1.6 -0.5) (end -1.6 0.45)
    (stroke (width 0.1) (type solid)) (layer "F.SilkS") (tstamp 8703eee1-ba08-49d9-9be1-68646a60b47a))
  (fp_line (start -0.85 -0.9) (end 0.85 -0.9)
    (stroke (width 0.1) (type solid)) (layer "F.SilkS") (tstamp f11d9056-96ac-4d82-9e5d-1b32468e2ab6))
  (fp_line (start -0.85 0.85) (end 0.85 0.85)
    (stroke (width 0.1) (type solid)) (layer "F.SilkS") (tstamp 1f7da782-09d6-4d4d-89ff-40fb46a97150))
  (fp_line (start 1.6 -0.4875) (end 1.6 0.45)
    (stroke (width 0.1) (type solid)) (layer "F.SilkS") (tstamp 28453027-7c0f-4e9b-a6fe-ebdd8a39116b))
  (fp_circle (center 0.05 1.85) (end 0.3 1.85)
    (stroke (width 0.1) (type solid)) (fill solid) (layer "F.SilkS") (tstamp 9067a79c-b75b-487c-8020-2c2f3237d678))
  (fp_rect (start -1.75 -1.425) (end 1.75 1.375)
    (stroke (width 0.1) (type default)) (fill none) (layer "F.CrtYd") (tstamp f45274f4-023d-46c9-b6b3-9102a346c1d7))
  (pad "1" smd roundrect (at -1.8875 0.9) (size 1.8 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
    (thermal_bridge_angle 45) (tstamp a736755b-3ee7-4834-b20f-dd891eb87bf1))
  (pad "2" smd roundrect (at -1.8875 -0.925) (size 1.8 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
    (thermal_bridge_angle 45) (tstamp f0553416-cdaa-4f5e-8ba9-2d3e8efeb98c))
  (pad "3" smd roundrect (at 1.875 -0.925) (size 1.8 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
    (thermal_bridge_angle 45) (tstamp eb4a1ea5-895d-417f-83b4-ff3781a592bf))
  (pad "4" smd roundrect (at 1.875 0.9) (size 1.8 0.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
    (thermal_bridge_angle 45) (tstamp 00ff1ada-4267-4928-922c-9476e42481ff))
)